Received multiple Best Paper Awards, including ICCAD 2024, IEEE TSM 2022, DATE 2022, etc.; also received the DAC 2024 Under-40 Innovator Award, among other honors.
Research Experience
Served as TPC Co-Chair for ACM/IEEE Workshop on Machine Learning for CAD (MLCAD) 2019, and International Symposium of EDA (ISEDA) 2025 & 2026. Participated in program committees of DAC, ICCAD, DATE, etc., and is on the editorial boards of IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), among others.
Education
M.E. from Tsinghua University, Ph.D. from the University of Texas.
Background
Currently a Professor in the Department of Computer Science and Engineering at The Chinese University of Hong Kong, and Assistant Dean (Mainland Affairs) in the Faculty of Engineering. Research interests include machine learning and deep learning with applications in electronic design automation (EDA) and computer vision.
Miscellany
Contact: Email byu[at]cse.cuhk.edu.hk; Phone (852)-3943-8435 (hardly reachable, email better); Office: Rm907, Ho Sin Hang Engineering Building; Consultation Hours: Monday 13:00–15:00 (by appointment or Zoom).