Lifecycle Cost-Effectiveness Modeling for Redundancy-Enhanced Multi-Chiplet Architectures

2026-01-26

AI Summary

This work addresses the lack of a comprehensive economic evaluation framework for multi-chiplet architectures that jointly considers manufacturing cost, redundancy strategies, and computational benefits over the system’s full lifecycle. We propose the first lifecycle cost-effectiveness (LCE) framework tailored to redundancy-enhanced multi-chiplet systems, integrating intra- and inter-chiplet redundancy modeling, reliability-driven lifetime prediction, and quantitative economic analysis of redundancy configurations. By incorporating redundancy-aware cost modeling and multi-objective optimization, our approach co-optimizes manufacturing overhead and operational lifespan. The framework reveals key mechanisms for synergistically optimizing module-level and chiplet-level redundancy, substantially improving overall system cost-effectiveness.

Technology Category

• Machine Learning: Hardware-aware ML
• Constraint Satisfaction and Optimization: Distributed CSP/Optimization
• Multiagent Systems: Mechanism Design

Application Category

• Economics, Online Markets and Human Computation: Cost models of using LLMs in production systems
• Systems and Infrastructure for Web, Mobile and WoT: Sustainability and carbon-aware systems for Web, mobile, and WoT
• Security and Privacy: Large-scale security measurements

Abstract

The growing demand for compute-intensive applications has made multi-chiplet architectures a promising alternative to monolithic designs, offering improved scalability and manufacturing flexibility. However, effectively managing the economic effectiveness remains challenging. Existing cost models either overlook the amortization of compute value over a chip's operational lifetime or fail to evaluate how redundancy strategies, which are widely adopted to enhance yield and fault tolerance, impact long-term cost efficiency. This paper presents a comprehensive cost-effectiveness framework for multi-chiplet architectures, introducing a novel Lifecycle Cost Effectiveness (LCE) metric that evaluates amortized compute costs by jointly optimizing manufacturing expenses and operational lifetime. Our approach uniquely integrates: (1) redundancy-aware cost modeling spanning both intra- and inter-chiplet levels, (2) reliability-driven lifetime estimation, and (3) quantitative analysis of how redundancy configurations on overall economic effectiveness. Extensive trade-off and multi-objective optimization studies demonstrate the effectiveness of the model and reveal essential co-optimization strategies between module and chiplet-level redundancy to achieve cost-efficient multi-chiplet architecture designs.

Problem

• multi-chiplet architectures
• cost-effectiveness
• redundancy
• lifecycle cost
• economic effectiveness

Innovation

• Lifecycle Cost Effectiveness
• Multi-Chiplet Architecture
• Redundancy Optimization
• Reliability-Driven Lifetime
• Cost Modeling