Scholar
Bo Wang
Google Scholar ID: hfRB4YoAAAAJ
Beijing Jiaotong University
Citations & Impact
Citations
366
H-index
10
i10-index
10
Publications
20
Co-authors
12
list available
Contact
Publications
Resume (English only)
Academic Achievements
- - [OOPSLA'25] Fuzzing C++ Compilers via Type-Driven Mutation
- - [TSE'25] A Comprehensive Study of OOP-Related Bugs in C++ Compilers
- - [ISSTA'21] Faster Mutation Analysis with Fewer Processes and Smaller Overheads
- - [ISSTA'17] Faster Mutation Analysis via Equivalence Modulo States (ACM SIGSOFT Distinguished Paper Award)
- - [ICSME'25] Boosting Redundancy-based Automated Program Repair by Fine-grained Pattern Mining (IEEE TCSE Distinguished Paper Award)
- - [TOSEM'22] L2S: A Framework for Synthesizing the Most Probable Program under a Specification
- - [TOSEM'21] Beyond Tests: Program Vulnerability Repair via Crash Constraint Extraction
Research Experience
- - March 2021 to present, Tenure-Track Assistant Professor at the School of Computer Science and Technology, Beijing Jiaotong University
- - December 2023 to December 2024, Visiting Scholar at the School of Computing and Information Systems, Singapore Management University
- - January 2019 to September 2019, Visiting Ph.D. student at the School of Computing, National University of Singapore, supervised by Prof. Abhik Roychoudhury
Education
- - 2021, Ph.D. in Computer Science from Peking University, supervised by Prof. Yingfei Xiong
- - 2015-2019, Master's degree from the University of Science and Technology of China
- - 2008-2012, Bachelor's degree from Central South University
Background
- Research interests include compiler testing and tuning, mutation analysis, and automated program repair. Currently, an Assistant Professor at the School of Computer Science and Technology, Beijing Jiaotong University.
Miscellany
- Served as a PC member for several international conferences such as FSE 2025, ASE 2025, etc.; also a reviewer for multiple journals including ACM Computing Surveys, IEEE Transactions on Software Engineering, etc.
