IEEE Fellow, Fellow of the Canadian Academy of Engineering (FCAE), and member of the College of New Scholars, Artists and Scientists of the Royal Society of Canada. Published over 180 journal papers and 120 peer-reviewed conference papers. Has been a key Organizing Committee Member for numerous IEEE conferences and workshops (e.g., co-Technical Chair for ChinaSIP2014, GlobalSIP2017, and ICIP2021, and co-General Chair of MMSP2018 and DSLW2021). Served as Associate Editor for IEEE TSP, SPL, TMM, TIFS, TBME, and SPM, and Area Editor of SPM, and is currently serving as Editor-in-Chief for IEEE SPL.
Research Experience
Was a Research Associate at the University of Maryland, College Park from 2002 to 2004; has been with the ECE department at UBC since August 2004.
Education
Received B.Sc. from Tsinghua University in 1996, and M.Sc. and Ph.D. from the University of Connecticut in 2000 and 2002, respectively, all in electrical engineering.
Background
Research interests include signal/image processing, machine learning/deep learning, biomedical data analysis, and digital media security.