Scholar
Xingyu Chen
Google Scholar ID: S4h-eTMAAAAJ
University of California San Diego
Citations & Impact
Citations
375
H-index
10
i10-index
10
Publications
20
Co-authors
0
Publications
Browse publications on Google Scholar (top-right) ↗
Resume (English only)
Academic Achievements
- Publications: MobiSys 2025, CVPR 2025, SenSys 2024, SenSys 2023, NDSS 2023, etc.; Awards: UC San Diego GPSA Travel Grant Award, SenSys'23 NSF Travel Grant Award, Best Student Paper Award at IEEE International Conference on Health Informatics 2022, Runner-up at IEEE COVID-19 Sensor Informatics Challenge Oct 2021, Best Paper Award at ACM SenSys 2019.
Research Experience
- June 2023 ~ September 2023: Microsoft Research Asia, Wireless Group (ShangHai), Research Intern, Mentored by Prof. Lili Qiu; August 2021 ~ August 2022: META Lab, University of Colorado Denver, Research Assistant; August 2018 ~ August 2021: ESC Group, State University of New York at Buffalo, Undergraduate Research Assistant; Fall 2021 ~ Spring 2022: University of Colorado Denver, Teaching Assistant.
Education
- Fall 2022 ~ Present: University of California, San Diego, Ph.D. in Computer Science and Engineering, Advisor: Prof. Xinyu Zhang; August 2018 ~ June 2021: State University of New York at Buffalo, Bachelor in Computer Science with Distinction, Advisor: Prof. Wenyao Xu.
Background
- Research Interests: RF Simulation, Rendering, Computer Vision/Graphics, Mobile Computing, Ray Tracing, Digital Twin, Virtual Reality, Differentiable Simulation & Rendering. Biography: Currently a third-year Ph.D. student in Computer Science and Engineering at the University of California, San Diego (UCSD).
Miscellany
- Service: Invited Reviewer for IEEE GlobeCom 2023 CISS, IEEE Transaction on Mobile Computing, IEEE Transaction on Services Computing, IEEE Network Magazine; Artifact Evaluation Committee for ACM MobiCom 2023, ACM MobiSys 2022, ACM SenSys/BuildSys Data Workshop 2022; Workshop Review for DeepWireless (January 2023); Volunteer Judge for CoorsTek Denver Metro Regional Science and Engineering Fair (February 2022).
Co-authors