Scholar
Hongyu Cai
Google Scholar ID: HbI5R54DJPEC
Purdue University
Citations & Impact
Citations
102
H-index
2
i10-index
2
Publications
5
Co-authors
0
Publications
Resume (English only)
Academic Achievements
- D-LiFT: Improving LLM-based Decompiler Backend via Code Quality-driven Fine-tuning (arXiv:2506.10125, 2025)
- Rethinking How to Evaluate Language Model Jailbreak (ACM Workshop on Artificial Intelligence and Security, 2025)
- A Progressive Transformer for Unifying Binary Code Embedding and Knowledge Transfer (IEEE SANER, 2024)
- Benchmark to Audit LLM Generated Clinical Notes for Disparities Arising from Biases and Stereotypes (NeurIPS Workshop, 2024)
- NN-Baton: DNN Workload Orchestration and Chiplet Granularity Exploration for Multichip Accelerators (ACM/IEEE ISCA, 2021)
Research Experience
- Oracle Labs, Research Assistant (Jun 2024–Sep 2024, Burlington, USA)
- MiraclePlus (formerly Y Combinator China), Industry Research (Jun 2024)
- Intel Corporation, Intern (Jun 2022–Sep 2022, Santa Clara, USA), Custom Compute Group; Homomorphic Encryption Accelerator
- Tsinghua University, Research Assistant (Jun 2020–Aug 2020, Beijing, China), Institute for Interdisciplinary Information Sciences
- Microsoft Research Asia, Research Intern (Jul 2019–Jun 2020, Beijing, China), Systems and Networking Research Group
Co-authors