Stacked Intelligent Metasurface-Aided Wave-Domain Signal Processing: From Communications to Sensing and Computing

📅 2026-01-22
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🤖 AI Summary
This work addresses the challenge of achieving high-speed, parallel, and energy-efficient signal processing directly in the electromagnetic wave domain to jointly support communication, sensing, and computing tasks. The authors propose a stacked intelligent metasurface (SIM) physical neural network that, for the first time, systematically integrates the feature extraction capabilities of neural networks with the intrinsic computational advantages of electromagnetic wave propagation. By stacking metasurface layers and modeling wave-domain dynamics, the architecture enables end-to-end trainable signal processing within the physical propagation process, facilitating multimodal functionality on a single hardware platform. Experimental results demonstrate SIM’s versatility across communication, sensing, and computing applications, exhibiting exceptional parallelism, ultra-low latency, and minimal power consumption, thereby establishing a new paradigm for wave-domain native intelligent hardware.

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📝 Abstract
Neural networks possess incredible capabilities for extracting abstract features from data. Electromagnetic computing harnesses wave propagation to execute computational operations. Metasurfaces, composed of subwavelength meta-atoms, are capable of engineering electromagnetic waves in unprecedented ways. What happens when combining these three cutting-edge technologies? This question has sparked a surge of interest in designing physical neural networks using stacked intelligent metasurface (SIM) technology, with the aim of implementing various computational tasks by directly processing electromagnetic waves. SIMs open up an exciting avenue toward high-speed, massively parallel, and low-power signal processing in the electromagnetic domain. This article provides a comprehensive overview of SIM technology, commencing with its evolutionary development. We subsequently examine its theoretical foundations and existing SIM prototypes in depth. Furthermore, the optimization/training strategies conceived to configure SIMs for achieving the desired functionalities are discussed from two different perspectives. Additionally, we explore the diverse applications of SIM technology across the communication, sensing, and computing domains, presenting experimental evidence that highlights its distinctive advantages in supporting multiple functions within a single device. Finally, we identify critical technical challenges that must be addressed to deploy SIMs in next-generation wireless networks and shed light on promising research directions to unlock their full potential.
Problem

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stacked intelligent metasurface
wave-domain signal processing
electromagnetic computing
physical neural networks
multifunctional integration
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Stacked Intelligent Metasurfaces
Wave-Domain Signal Processing
Physical Neural Networks
Electromagnetic Computing
Metasurface-Aided Computing
Jiancheng An
Jiancheng An
Nanyang Technological University
Stacked Intelligent MetasurfaceFlexible Intelligent MetasurfaceSIMFIM
Chau Yuen
Chau Yuen
IEEE Fellow, Highly Cited Researcher, Nanyang Technological University
WirelessSmart GridLocalizationIoTBig Data
M
M. D. Renzo
Universit´e Paris-Saclay, CNRS, CentraleSup´elec, Laboratoire des Signaux et Syst`emes, 3 Rue Joliot-Curie, 91192 Gif-sur-Yvette, France; and King’s College London, Department of Engineering - Centre for Telecommunications Research, WC2R 2LS London, United Kingdom
M
Mehdi Bennis
Centre for Wireless Communications, University of Oulu, 90570 Oulu, Finland
M
Mérouane Debbah
Khalifa University of Science and Technology, P O Box 127788, Abu Dhabi, UAE
L
Lajos Hanzo
School of Electronics and Computer Science, University of Southampton, Southampton SO17 1BJ, U.K.