🤖 AI Summary
Thermal simulation of 3D integrated circuits faces efficiency bottlenecks due to high power density: conventional PDE solvers offer high accuracy but suffer from prohibitive computational cost, while existing machine learning methods—such as Fourier Neural Operators (FNOs)—often lose high-frequency thermal features and critically depend on scarce, expensive high-fidelity training data.
Method: We propose an enhanced FNO framework integrating self-attention mechanisms and a U-Net architecture, coupled with a transfer learning strategy. Self-attention improves modeling of long-range thermal coupling; U-Net preserves fine-grained, high-frequency temperature gradients; and transfer learning enables effective fine-tuning using low-fidelity data, drastically reducing reliance on high-fidelity labels.
Contribution/Results: Our method achieves state-of-the-art prediction accuracy while accelerating thermal simulation by 842× over finite element analysis, significantly enhancing design iteration efficiency without compromising fidelity.
📝 Abstract
Thermal management in 3D ICs is increasingly challenging due to higher power densities. Traditional PDE-solving-based methods, while accurate, are too slow for iterative design. Machine learning approaches like FNO provide faster alternatives but suffer from high-frequency information loss and high-fidelity data dependency. We introduce Self-Attention U-Net Fourier Neural Operator (SAU-FNO), a novel framework combining self-attention and U-Net with FNO to capture long-range dependencies and model local high-frequency features effectively. Transfer learning is employed to fine-tune low-fidelity data, minimizing the need for extensive high-fidelity datasets and speeding up training. Experiments demonstrate that SAU-FNO achieves state-of-the-art thermal prediction accuracy and provides an 842x speedup over traditional FEM methods, making it an efficient tool for advanced 3D IC thermal simulations.